电路设计英文简历表格
简历如果围绕自己的优势做个人简历那对于企业来说毫无作用，你预算做得再好对会计又有什么帮助?但是如果以会计为中心，你在这方面只是略知皮毛而已，此时还怎么表现自己?难道表现自己是一个门外汉或者水平较低的`人吗?到底运用什么方法能够解决这个大难题?
在这里我们建议大家还是要以自己的优势为主，但是必须学会灵活运用这种优势，比如你做预算是不是对数字特别敏感?而这个数字也是会计工作面对的主要对象，所以这种敏感度能够帮助你更快地完成会计工作，还可以提升会计工作的准确度。这种思路就是告诉求职者要懂得寻找两种看上去不同的工作存在的相似之处，比如预算和会计都得面对很多数字，而且做这两份工作都得非常仔细并且要进行严格的检查，还需要极强的耐心才能将其做好，那么在简历里把这些方面的东西展现出来不就行了吗?
下面是yjbys小编和大家分享的电路设计英文简历表格，更多内容请关注简历表格栏目。
| Name：yjbys | Hukou： | |||||
| Residency：Shenzhen | Work Experience： | |||||
| Current Salary： | Tel： | |||||
| E-mail：www.ruiwen.com/jianli | ||||||
| Career Objective | ||||||
| Desired Industry： | Electronics/Semiconductor/IC | |||||
| Desired Position： | IC Design/Application Engineer | |||||
| Desired address： | Beijing ,Shanghai ,Shenzhen ,Guangzhou | Desired Salary： | ￥15,000-19,999/Month | |||
| Work Experience | ||||||
| 2006/05—Present | ***Company | |||||
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Industry: Computers, Hardware Dept. of Wireless Communication IC Design/Application Engineer Responsibilities： 1. Development of RF transceivers for GSM in RF-CMOS technology. 2. Lead project team of GSM RF as a vice team leader, including 20+ teammates. 3. Take part in developing transceiver architecture, requirements and specifications. 4. Accomplish Sigma-Delta fractional-N synthesizer key blocks simulation and design, include VCO, PFD, CP, LPF, and accomplish the layout design, this chip have tape-out. 5. Fulfill with the mixed-signal simulation and verification under the platform of Cadence LDV. |
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| 2005/04—2006/05 | Rising Micro Electronics Co. Ltd | |||||
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Industry: Electronics/Semiconductor/IC Dept. of Design IC Design/Application Engineer Responsibilities： 1. Development of 3G RF transceiver for TD-SCDMA in IBM BiCMOS technology, take part in TD-SCDMA project as a team member, accomplish LNA and Mixer simulation and design, this chip have tape-out and realized mass production, the measured NF=2.5dB, IIP3=-11dBm. 2. Development of 3G RF transceiver for WCDMA in JAZZ BiCMOS technology, accomplish the LPF (Low pass filter) and AGC (auto gain amplifier) design, include schematic and layout, this chip have tape-out. |
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| Education and Training | ||||||
| 2002/09—2005/07 | Lanzhou University Microelectronics Master | |||||
| 1996/09—2000/07 | North China University of Technology Electronic Science And Technology Bachelor | |||||
| Professional Skills | ||||||
| Language Skills： | English VERY GOOD | |||||
| Computer Skills： | Circuit Design skilled 50Month | |||||
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